Difference between revisions of "Microduino-10DOF"

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* '''[[Microduino-10DOF]]''' main chips and devices
 
* '''[[Microduino-10DOF]]''' main chips and devices
 
** 3-axis gyroscope + 3-axis accelerometer: 【'''[[media:MPU6000andMPU6050.pdf|MPU6050]]'''】
 
** 3-axis gyroscope + 3-axis accelerometer: 【'''[[media:MPU6000andMPU6050.pdf|MPU6050]]'''】
** 3-axis compass: 【'''[[media:HMC5883L.pdf|HMC5883L]]'''】
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** 3-axis compass: 【'''[[media:HMC5883L_en.pdf|HMC5883L]]'''】
** temperature + pressure sensor: 【'''[[media:BMP085.pdf|BMP085]]'''】
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** temperature + pressure sensor: 【'''[[media:BMP180_en.pdf|BMP085]]'''】
  
 
:[[file:Micromodule-10DOF-1.png|800px|thumb|left|Microduino-10DOF-Pinout]]
 
:[[file:Micromodule-10DOF-1.png|800px|thumb|left|Microduino-10DOF-Pinout]]
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== Development ==
 
== Development ==

Revision as of 14:29, 11 February 2014

Microduino-10DOF

Microduino-10DOF module use IIC interface to connect with core module and integrates 4 kinds of sensors. MPU6050 uses to 3-axis gyroscope and 3-axis accelerometer, HMC5883L uses to 3-axis compass,BMP085 for temperature and pressure sensor. This module widely used in automation control, such as aeromodelling,self-balancing car.

Features

  • Three kinds of sensors all use I2c interface to connect with core module which save the IO interface, widely used in embedded system;
  • Small, cheap, stackable, opened platfrom;
  • Open source hardware circuit design, compatible with the Arduino IDE development environment for programming;
  • Defines unified interface Microduino specification and contain rich peripheral modules. Set up the quick connection with other Microduino modules and sensors easily and flexibly.
  • 2.54 pitch row female connector for easy integration into breadboard.

Specification

Magnetic field intensity sensor:HMC5883L

  • HMC5883L contains the most advanced high-resolution HMC118X series magnetoresistive sensor;
  • Integrated circuit with Honeywell patents, including amplifier, automatic degaussing actuator, offset calibration, 12 bit AD converter with the accuracy of the compass can be controlle in the 1 ° ~ 2 °;
  • Simple I2C serial bus interface.


Digital Pressure Sensor:BMP180

  • BMP180 comprises resistive pressure sensor, AD converter, and a control unit;
    • The control unit includes E2PROM and I2C interfaces. BMP180 transmits uncompensated temperature and pressure values. E2PROM stores 176bit individual standard data, which used for compensation of temperature dependence and the other sensor parameters.
  • Available range: 300hPa to 1100hPa (corresponding sea level -500m to +9000 m)
  • Lowest absolute accuracy can be achieved 0.03hPa
  • UP = pressure data (16 to 19bit)
  • UT = temperature data (0 to 15bit)

Triaxial accelerometer + three-axis gyro sensor:MPU6050

  • It integrates a 3-axis MEMS gyroscope, three-axis MEMS accelerometer, and a scalable digital motion processor DMP (Digital Motion Processor);
  • Digital output for 6 or 9 axis rotation matrix, quaternion, Euler angles format (EulerAngleforma) data fusion algorithms;
  • With 131LSBs / ° / sec sensitivity and whole cell sensing range is ± 250, ± 500, ± 1000 and ± 2000 ° / sec of 3-axis angular velocity sensor (gyroscope);
  • 3-axis accelerometer is programmable control and the range is ± 2g, ± 4g, ± 8g and ± 16g;
  • Reduces the impact of setting given and sensor drift by removing the shaft between the accelerator and the gyro sensitivity, ;
  • The complexity of data fusion algorithms, sensors synchronization, load position sensors can be reduced by useing Digital motion processing (DMP: DigitalMotionProcessing) engine
  • A temperature sensor with digital output;
  • Gyro operational current: 5mA, gyroscope standby current: 5uA; accelerator operation current: 500uA, accelerator power saving mode current: 40uA @ 10Hz up to 400kHz fast mode of I2C.
Microduino-10DOF-Pinout1

Documents

  • Microduino-10DOF Eagle source file 【download
  • Microduino-10DOF main chips and devices
    • 3-axis gyroscope + 3-axis accelerometer: 【MPU6050
    • 3-axis compass: 【HMC5883L
    • temperature + pressure sensor: 【BMP085
File:Micromodule-10DOF-1.png
Microduino-10DOF-Pinout


Development

Arduino Libraries and support packages

Applications

Download

Use open source of MWC test 10dof module

  • The hardware need to be prepared:Microduino FT232R、Microduino Core、Microduino 10dof;
  • The software need to be prepared:MultiWii(Linux/Mac/Windows)、MultiWii source code(Arduino)、Arduino IDE(above 1.0 version);
  • First use IED open MultiWii.ino in MultiWii directory,the project can be load directly. The provided source code has already been configured for Microduino 10dof.Select board "Microduino Core (Atmega328P@16M,5V)",and then downloaded directly;
  • Turn on the PC. Take the Windows as example,Execution "MultiWiiConf.exe" in MultiWiiConf \ application.windows32 directory,select the corresponding serial port, then click "Start" to test module.

Use OLED test 10dof module

  • The hardware need to be prepare:Microduino FT232R、Microduino Core、Microduino 10dof、Microduino OLED;
  • The software need to be prepare:Arduino IDE(above 1.0 version)、Microduino provide test source code(Arduino)、BMP180 Library、HMC5883 LLibrary、MPU6050 Library、I2Cdev Library、U8glib Library;
  • The downloaded libraries should be put into library folder within Arduino IDE's installation folder;
  • Start Arduino IED,Open the test code that Microduino provided,select board "Microduino Core (Atmega328P@16M,5V)",and then downloaded directly;
  • After the download, please pay attention to the OLED is complete:
    • Top row is used to test HM5883L,The module is placed in the horizontal position, turn the module can be observed that pointer always points to an angle;
    • The middle row is used to test BMP180, observing pressure and temperature data;
    • The last line is used to test MPU6050, tilt module,then you can observe the ball rolling toward the corresponding direction.


History

  • April 8,2013,@laoPanorz found SI pin doesn't connect to VDD in HMC5883l.
  • Feb 28,2013, test release publish, no major issue.
  • Feb 18,2013, the first official release layout.

Pictures

Microduino 10DOF Front


Microduino 10DOF Back